IGBT 优派克IGBT 标准系列高速型 IGBT模块技术支持

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华南理工大学科技开发公司  | 当前位置：电子元器件 >>德国优派克EUPEC IGBT >>技术支持

FUJI 富士电机功率半导体 Eupec 优派克功率模块 技术支持 高速系列IGBT模块 低损耗系列IGBT模块 Semikron 西门康功率模块 SanRex 三社功率模块 IGBT 驱动电路 电容器Capacitors 其它配套器件 退出 免费索取技术资料光盘 留言板 您的意见非常重要！       EUPEC IGBT模块技术支持 Application Notes   IGBT Mounting instructions for IHM and IHV modules Paralleling of EconoPACK™+ Short Circuit Behaviour of IGBT³ 600V New RthCH data sheet values Mounting instructions EasyPIM™750- and EasyPACK-Modules with screw clamps Switching behavior and optimal driving of IGBT modules Mounting instructions EasyPIM™ / EasyPACK Modules with screw clamps Aging stability of various heat-conducting pastes Mounting instructions for IHM & IHV modules Mechanical Attributes for new F S FP Econo Serie Mounting instructions 62mm C-series Short Circuit Operation of 6.5kV IGBTs Simple and reliable connecting system of eupec 62 mm C- Series IGBT Modules to a Power Circuit Board (PCB) Mounting of EconoPACK+ Modules Mounting instructions 62mm C-series Paralleling of IGBTs Definition of FIT and MTBF Thermal Impedance Model Series connection of IGBTs PCB mounting on Econo modules DC-current rating for new EconoPack3 modules with IGBT³ Using integrated NTC with reliable isolation   Archives Clamping of VGE Econo Modules: Mechanical Attributes PCB layout for Econo boardsmore Effect of Gate-Emitter Capacitor CGE Heat Sink Specification for IGBT Modules IGBT High Power Modules Comparison of thermal compounds and heat conducting foils Current lead capacity of PCB traces Mounting of EconoPack+ Module How is the nominal current IC for IHM/IHV IGBT modules derived? Mounting of EconoPack+ Module Pin Current Ratings for Econo Modules Insulation coordination for Econo III Mounting of the IGBT-High-Power-Modules 140x190mm Mounting of the IGBT-High-Power-Modules 140x130mm Measurement of the circuit stray inductance Definition of the module stray inductance LS Standard IGBT Modules: Mechanical Attributes Editorials   IGBT Current Shunt Resistors integrated in IGBT Power Modules for Medium Power Drive Application 600V IGBT-Technology in New Low Cost Modules for Consumer Drives Applications New 3300V High Power EmCon-HDR Diode with High Dynamic Robustness Repetitive short circuit behaviour of Trench-/Field-Stop IGBTs Coreless transformer a new technology for half bridge driver ICs The new 6.5kV IGBT module: a reliable device for medium voltage applications 1700V Trench IGBT Modules Design Proposal for LOW Power Drives EconoMAC the first all-in-one IGBT module for matrix converters The EasyPIM / EasyPACK IGBT Module Family for Compact Inverter Design EconoPACK+ a new IGBT module for optimized inverter solutions Novel compact low power IGBT Modules 6.5kV IGBT-Modules Further Improvements in the Reliability of IGBT Modules Technical Improvements in 1700V High Power IGBT Modules with rated currents up to 2400A Dickdraht-Bondverbindungen ist ein dominantes Qualitätsthema "Econo" my improvement in inverter-converter-moduledesign IGBT Module Technology: State of the Art and Future Evolutions Application and Characteristics of High Voltage IGBT Modules Design Aspects for Inverters with IGBT High Power Modules Improved Characteristics of 3.3kV IGBT Modules       您的订单！ 名  称： 华南理工大学科技开发公司 地  址： 广州 五山 华南理工大学校内 南秀村9栋首层 510640 电  话： +86（020）85511281；87111007；85510195；87588466；87595677（直线） 传  真： +86（020）85511287（直线）；或分机转808 开户行： 工商银行广州五山支行 账  号：3602002609000113774 联系人： 李耀光-803；徐之文-809；薛英杰-802；赵永智-805；公国庆-801分机         华南理工大学科技开发公司版权所有©。Jan. 1998 本页最后更新日期：2006年11月1日